Trench mosfet with depleted gate shield and method of manufacture

ABSTRACT

A semiconductor device, method of manufacture of a semiconductor device, and electronic system are disclosed. For example, the semiconductor device includes at least one trench disposed in a semiconductor substrate of the semiconductor device, wherein the semiconductor substrate has a first conductivity type. The semiconductor device further includes a polysilicon depleted gate shield disposed in the at least one trench, wherein the polysilicon depleted gate shield has a second conductivity type. The semiconductor device also includes a drift region disposed in the semiconductor substrate adjacent to at least one sidewall of the at least one trench, wherein the drift region has the first conductivity type, and a polysilicon gate disposed over the depleted gate shield in the at least one trench.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a divisional of U.S. application Ser. No. 15/205,920 filed Jul. 8, 2016, now U.S. Pat. No. 10,163,639, which application claims priority to U.S. Provisional Patent Application No. 62/190,341 filed Jul. 9, 2015, the contents of all such applications being incorporated herein by reference in their entirety.

BRIEF DESCRIPTION OF THE DRAWINGS

Understanding that the drawings depict only exemplary embodiments and are not therefore to be considered limiting in scope, the exemplary embodiments will be described with additional specificity and detail through the use of the accompanying drawings.

FIGS. 1A-1W depict a process of forming a trench MOSFET cell with a depleted gate shield, which can be utilized to implement one or more exemplary embodiments of the present invention.

FIG. 2 depicts a cross-sectional view of a semiconductor device that can be formed utilizing the exemplary process depicted in FIGS. 1A-1W.

FIG. 3 is a schematic block diagram of an electronic system that can be utilized to implement one exemplary embodiment of the present invention.

DETAILED DESCRIPTION

In the following detailed description, reference is made to the accompanying drawings that form a part hereof, and in which are shown by way of specific illustrative embodiments. However, it is to be understood that other embodiments may be utilized and that logical, mechanical, and electrical changes may be made. Furthermore, the method presented in the drawing figures and the specification is not to be construed as limiting the order in which the individual acts may be performed. The following detailed description is, therefore, not to be construed in a limiting sense. Wherever possible, the same or like reference numbers are used throughout the drawings to refer to the same or like structural components or parts.

Metal-oxide-semiconductor field effect transistors (MOSFETs) are commonly utilized in electronic circuits, such as, for example, communication systems, power supplies, and the like. Power MOSFETs are commonly utilized in power supply and/or power conversion applications, such as, for example, as electronic switches that can enable and disable the conduction of large currents (e.g., 5 A-100 A) in DC to DC power converters and the like. Power MOSFETs include a large number of MOSFET cells and/or individual transistor devices that are connected in parallel and distributed across the surface of a semiconductor die. In order to maximize power conversion efficiency, the power MOSFETs utilized must minimize both conduction and switching losses. Power MOSFET conduction losses are proportional to the drain-to-source resistance in the operation or “on” state (RDSON) of the transistor device involved. Switching losses are proportional to the switching frequency and internal parasitic capacitance, and most significantly, to the gate-to-drain capacitance (Cgd) of the transistor device involved. Trench power MOSFETs are thus widely utilized in switching applications due to their characteristically low RDSON.

Trench power MOSFETs utilize a “shielded” gate or “split” gate architecture to improve the tradeoff between breakdown voltage (BV) and RDSON. Under the split gate architecture, a dielectrically isolated shield is formed under the polysilicon gate within a trench in a cell of the MOSFET device. The shield is electrically connected to the source terminal of the MOSFET device. Although incremental improvements have been made to improve the tradeoff between BV and RDSON (e.g., through feature size scaling techniques) of existing devices, these improvements have been made at the expense of increased manufacturing complexity.

A more pressing concern for manufacturers of shielded gate trench power MOSFETs is the tradeoff between reduced on resistance (RON) versus increased gate-to-source capacitance (Cgs) and drain-to-source capacitance (Cds) across the field oxide adjacent to the shield. For example, an in-situ doped N+ polysilicon material is typically utilized to form the shield. Consequently, the parasitic output capacitance (COSS) of the MOSFET device is dominated by the surface area of the polysilicon shield and the thickness of the oxide adjacent the shield. As a result, a significantly high electric field is generated across the oxide adjacent the shield when the MOSFET device is in the “off” or non-operational state. This result requires the manufacturers to utilize a thick layer of oxide adjacent the shield to ensure the reliability of the MOSFET device against the adverse effects of such events as hot carrier injections and time-dependent dielectric breakdowns. As described below, the present invention resolves these and other, related problems with a depleted shield, split gate trench power MOSFET device formed on an integrated circuit, wafer, chip or die.

In accordance with the teachings of the present application, a depleted gate shield is formed in a trench in a split gate trench power MOSFET device. The depleted gate shield, which is a dopant type opposite to that of the drift region adjacent the trench, significantly reduces the magnitude of the electrical field in the oxide material adjacent the shield and in the trench, and thereby transfers a substantial amount of the stress generated by the electric field to the polysilicon material of the shield while the power MOSFET device is in the “off” state. Consequently, the device manufacturer can utilize a significantly thinner (e.g., −10 nm) than usual layer of oxide material adjacent the shield and, as a result, significantly reduce the overall width of the trench (e.g., from approximately 0.5 μm to approximately 0.2 μm) and the cell pitch of the device to produce a significantly lower than typical RDSON. The depleted gate shield trench power MOSFET device also significantly reduces its output capacitance (COSS) as a function of its drain-to-source voltage (Vds). As the gate shield is being depleted, the COSS is reduced or scaled down as a function of the width of the depletion area.

FIGS. 1A-1W depict a process of forming a trench MOSFET cell 100 including a depleted gate shield, which can be utilized to implement one or more exemplary embodiments of the present invention. In one embodiment, a plurality of MOSFET cells 100 can be electrically connected in parallel to form, for example, a power trench MOSFET device with a high current carrying capacity. The power MOSFET device can be an n-channel device or a p-channel device, where “n” denotes a negative carrier type (e.g., electron), and “p” denotes a positive carrier type (e.g., hole). As such, although the embodiment depicted herein is described in terms of a dopant species for an N-channel MOSFET (N-MOS) device, a second embodiment can utilize the opposite dopant type species to form a P-channel MOSFET (P-MOS) device.

FIG. 1A depicts a cross-sectional view of a semiconductor substrate 102 on which a trench MOSFET device 100 including a depleted gate shield can be formed. For this exemplary embodiment, the trench MOSFET 100 is an N-MOS device, and the substrate 102 is formed with an n-type (N+) semiconductor material, such as, for example, phosphorous, antimony or arsenic. The substrate 102 includes an active surface 101 and back surface 103 opposite the active surface 101. For this embodiment, a p-type epitaxial (p-epitaxial) region 104 is grown over the N+ substrate (drain) region 106. The thickness of the p-epitaxial region 104 is approximately 1 μm. A first insulating layer 108 (referred to herein as a thermal oxide layer) is formed over the active surface 101 utilizing, for example, a physical vapor deposition (PVD), chemical vapor deposition (CVD), thermal oxidation, or other suitable oxide deposition process. In this embodiment, the thermal oxide layer 108 is approximately 50 nm thick, and can be formed utilizing one or more layers of silicon dioxide (SiO2), tantalum pentoxide (Ta205), aluminum oxide (Al203), or other suitable material for such an insulating layer. In addition to insulating, the thermal oxide layer 108 also functions herein as a pad oxide layer to provide structural support.

Next, a second insulating or dielectric layer 110 (referred to herein as a hard mask layer) is deposited on the thermal oxide layer 108. For this exemplary embodiment, the hard mask layer 110 is approximately 200 nm thick and is formed utilizing one or more layers of silicon nitride (Si3N4), silicon oxynitride (SiON), polyimide, benzocyclobutene (BCB), polybenzoxazoles (PBO), or other suitable dielectric material. The hard mask layer 110 is deposited on the thermal oxide layer 108 utilizing, for example, a PVD, CVD, screen printing, spin coating, spray coating, or other suitable deposition process. Notably, in this embodiment, both the thermal oxide layer 108 and hard mask layer 110 are utilized in combination as an etch stop for terminating the etching process at controllable depths during subsequent processing steps described below. For example, a photo-resist (PR) layer or mask is formed over the hard mask layer 110. A suitable portion of the PR layer is removed, and a photolithography (e.g., dry etch) process is utilized to remove a portion (e.g., approximately 0.20 μm wide) of the thermal oxide layer 108 and hard mask layer 110 down to the active surface 101 of polysilicon.

As shown in FIG. 1B, a suitable CMOS sidewall spacer formation process is then utilized to form a first sidewall spacer 112 and a second sidewall spacer 114 adjacent to the exposed sides of the thermal oxide layer 108 and hard mask layer 110. In this embodiment, the width of the spacers 112, 114 is approximately 200 nm, and the distance between the spacers 112, 114 is approximately 0.16 μm. A PR layer is then formed over the hard mask layer 110, a suitable portion of the PR layer is removed, and a photolithography or other suitable silicon etch process is utilized to form a trench 116 through the hard mask layer 110, the thermal oxide layer 108, the p-epitaxial region 104, and extending partially into the N+ region 106. Alternatively, the trench 116 can be formed utilizing a laser direct ablation (LDA) process. In this embodiment, the depth of the trench 116 is approximately 1 μm. Next, as shown in FIG. 1C, a suitable oxide wet etch process is utilized to remove the sidewall spacers 112, 114. A sacrificial oxide (Sac Ox) layer is then grown approximately 20 nm thick on the exposed surfaces in the trench 116. The Sac Ox layer is then removed utilizing a suitable oxide wet etch process.

As shown in FIG. 1D, an oxide layer 118 is then grown on the exposed surfaces of the trench 116. In this embodiment, the thickness of the oxide layer 118 is approximately 300 Å. In FIG. 1E, a p-type gate shield 120 is formed within the trench 116. The trench 116 is filled with a suitable oxide material to form a field oxide or insulating region 122 adjacent the shield 120. The oxide region 122 can be formed, for example, utilizing a suitable dielectric insulating material, such as tetraethyl-orthosilicate (TEOS) deposited with a high temperature, low pressure deposition process, such as a vapor deposition process. In a second embodiment, the oxide region 122 can be formed utilizing another suitable dielectric insulating material, such as one or more layers of SiO2, Si3N4, SiON, Ta205, Al203, polyimide, BCB or PBO.

As described above, the shield 120 is formed with a suitable p-type polysilicon material and electrically connected to the source terminal of the MOSFET device. Notably, the polysilicon (p-type) shield 120 is doped oppositely of the N+ (drift) region in the substrate and adjacent to the trench 116 so that the shield 120 will be effectively depleted when the MOSFET device is turned off. For example, in order to control the dopant type and doping concentration of the p-type shield 120 to enable the depletion to occur, a suitable diffusion process, implant process, or in-situ doping process can be utilized to form the shield 120. As a result, both the Cgs and Cds of the depleted gate shield trench MOSFET device are substantially reduced compared to existing trench MOSFET devices. Returning to FIG. 1E, a suitable chemical-mechanical polishing or planarization (CMP) process is then utilized to smooth the surface of the oxide layer 122 down to the nitride material of the hard mask layer 110. Next, utilizing a PR mask and suitable oxide etch process, the filed oxide region.

As shown in FIG. 1F, utilizing a PR mask and suitable oxide etch process, a portion of the field oxide region 122 over the shield 120 is removed. An oxide layer approximately 20 nm thick is then grown on the exposed surfaces. The “removed” region is then refilled with an N+ polysilicon material to form a gate structure or region 124. The surface of the N+ polysilicon material is then planarized down to the hard mask layer 110 utilizing a suitable CMP process. Notably, the hard mask layer 110 functions as a mask to protect the active surface 101 during the CMP process. As shown in FIG. 1F, for this exemplary embodiment, the polysilicon gate 124 extends approximately 0.40 μm into the p-epitaxial region 104, the distance between the polysilicon gate 124 and the shield 120 is approximately 0.10 μm, and the distance between the upper surface of the shield 120 and the bottom of the trench 116 is approximately 0.50 μm.

As shown in FIG. 1G, utilizing a suitable etch process, a portion of the polysilicon in the gate region 124 is removed down to the surface of the thermal oxide layer 108. A thermal oxidation process is then utilized to oxidize the polysilicon material in the gate region 124 to a depth of approximately 20 nm. As shown in FIG. 1H, utilizing a suitable oxide deposition process, a layer 126 of a suitable oxide material (e.g., SiO2) is deposited on the oxidized surface of the gate polysilicon region 124 and the hard mask layer 110. In this embodiment, the deposited oxide layer 126 is approximately 5000 Å thick. As shown in FIG. 1I, a suitable CMP process is then utilized to planarize the oxide layer 126 down to the level of the hard mask layer 110. Next, as shown in FIG. 1J, a suitable etch process is utilized to remove the nitride material of the hard mask layer 110. Then, as shown in FIG. 1K, a suitable ion implantation process is utilized to deposit a p-type dopant (e.g., Boron, Aluminum or Gallium) with a typical concentration of approximately 5E17 cm-3 into the p-epitaxial region 104 to form the p-channel region 128.

Next, as shown in FIG. 1L, a suitable ion implantation process is utilized to heavily dope the substrate within the p-epitaxial region 104 with n-type semiconductor material, such as, for example, phosphorous, antimony or arsenic, to form an N+ region 130 within the p-channel region 128. As shown in FIG. 1M, a suitable process is then utilized to deposit one or more oxide spacers on the sidewalls of the oxide layer 126 to form an oxide spacer 132. The one or more spacers can be formed utilizing a PVD, CVD, screen printing, spin coating, spray coating, or other suitable oxide deposition process. In one embodiment, for example, the one or more spacers can include TEOS deposited utilizing a high-temperature, low-pressure deposition process, such as vapor deposition. In a second embodiment, the spacers can be formed with one or more layers of SiO2, Si3N4, SiON, Ta205, Al203, polyimide, BCB, PBO, or other suitable insulating or dielectric material. Next, as shown in FIG. 1N, a suitable silicon etch process is utilized to remove a portion of the n-type material in the N+ region 130 and approximately 0.20 μm of the silicon in the p-channel region 128. Then, as shown in FIG. 1O, a p-type dopant, such as, for example, Boron, Aluminum or Gallium, is deposited by ion implantation with a suitable dosage to form P+ region 134 adjacent the p-channel region 128.

FIG. 1P depicts a cross-sectional view of the gate contact region adjacent the active channel region shown in the cross-sectional view depicted in FIGS. 1A-1O. In FIG. 1P, a PR mask is formed over the insulating layer 132 (e.g., oxide spacer 132 in FIGS. 1A-1O). Utilizing a suitable photolithography process (e.g., oxide dry etch process) is utilized to remove a portion of the insulating layer 132 to form the opening 136 extending to the gate region 124. In a second embodiment, the opening 136 can be formed, for example, utilizing an LDA process. A p-type dopant, such as Boron, Aluminum or Gallium, is deposited by ion implantation into the opening 136 to form a P+ region as an ohmic contact. FIG. 1Q depicts a cross-sectional view of the shield contact region adjacent the active channel region shown in the cross-sectional view depicted in FIGS. 1A-1O. Referring to FIG. 1Q, similarly to the process described directly above with respect to FIG. 1P, an opening 138 is also formed in the insulating layer 132. The opening 138 extends to the shield region 120. A p-type dopant, such as Boron, Aluminum or Gallium, is deposited by ion implantation into the opening 138 to form a P+ region as an ohmic contact. Next, as shown in FIG. 1R, an electrically conductive material is deposited into the openings 136 and 138 utilizing a PVD, CVD, electrolytic plating, electro-less plating, sputtering, or other suitable metal deposition process. In this exemplary embodiment, the electrically conductive material is Tungsten (W) including an adhesion layer of Titanium or Titanium Nitride. However, in a second embodiment, the electrically conductive material can be one or more layers of Al, Cu, Sn, Ni, Au, Ag, or other suitable electrically conductive material.

In FIG. 1R, the deposited electrically conductive material (e.g., W) is shown with respect to the cross-sectional view of the active channel region. In FIG. 1S, the deposited electrically conductive material (e.g., W) is shown with respect to the cross-sectional view of the gate contact region. In FIG. 1T, the deposited electrically conductive material (e.g., W) is shown with respect to the cross-sectional view of the shield contact region.

In FIG. 1U, utilizing a suitable metal deposition process, an electrically conductive or metal layer 142 is deposited over the planarized surface of the device 100 as shown. The metal layer 142 is approximately 4 μm thick and formed with an AlCu material. In a second embodiment, the metal layer 142 can formed with one or more layers of Al, Cu, Sn, Ni, Au, Ag, W, or other suitable electrically conductive material. A PR layer or mask is formed and a suitable metal dry etch process is utilized to remove certain portions of the metal layer 142 down to the surface of the silicon. As a result of the etch process, the metal layer 142 forms a source metal interconnect layer that is electrically connected to the N+ (source) region 130 and the p-channel region 128, as shown in the active channel region depicted in FIG. 1U. The etched metal layer also forms a gate metal interconnect layer 144, as shown in the gate contact region depicted in FIG. 1V. The etched metal layer also forms a source metal interconnect layer 146, as shown in the shield contact region depicted in FIG. 1W. A suitable passivation process is then utilized to pattern bond pads or solderable contact pads on the die including the device 100. A suitable wafer thinning process is also performed to reduce parasitic N++ resistances, and the backside 103 of the die is metallized to form the drain metal on the drain region 106.

FIG. 2 depicts a cross-sectional view of a semiconductor device 200 that can be formed utilizing the exemplary process depicted in FIGS. 1A-1W, in accordance with one exemplary embodiment of the present invention. The cross-sectional view depicted in FIG. 2 shows the active channel region of the semiconductor device 200. Referring to FIG. 2, the exemplary semiconductor device 200 includes three trenches (e.g., trench 202). For ease of understanding, since the three trenches are structured virtually identically, only the one trench 202 will be described. The trench 202 includes a polysilicon gate region 204 disposed over a polysilicon (gate) shield region 206. The gate region 204 is electrically and physically isolated from the shield region 206 by a dielectric or insulating region 208. The shield region 206 is electrically connected to the source and thus the source metal layer 210 of the semiconductor device 200. The trench 202 extends into the n-type drift region 212. Notably, in accordance with the present invention, the (p-type) shield region 206 is doped opposite to that of the (n-type) drift region 212, which enables the shield region 206 to deplete when the semiconductor device 200 is in the “off” state. Consequently, the magnitude of the electrical field in the oxide material 208 adjacent the shield region 206 is significantly reduced, and thereby transfers a substantial amount of the stress generated by the electric field to the polysilicon material of the shield region 206 while the power MOSFET device 200 is in the “off” state. The semiconductor device 200 also includes an N++ substrate 214 that forms a drain region of the semiconductor device 200. The drain region is electrically connected to the drain metal 216. A channel region 218 is formed in the semiconductor device 200 adjacent a trench.

FIG. 3 is a schematic block diagram of an electronic system 300, which can be utilized to implement one exemplary embodiment of the present invention. In the exemplary embodiment shown, electronic system 300 includes a power subsystem 302, a digital processor unit 304, and a peripheral subsystem 306. For example, the digital processor unit 304 can be a microprocessor or microcontroller and the like. The peripheral subsystem 306 includes a memory unit 308 for storing the data processed by the digital processor unit 304, and an input/output (I/O) unit 310 for transmitting and receiving the data to/from the memory unit 308 and the digital processor unit 304. In the exemplary embodiment depicted in FIG. 3, the power subsystem 302 includes a DC-DC controller 312, and a power trench MOSFET device 314 including a depleted gate shield utilized to enable and disable the conduction of large currents in the DC-DC controller 312. The DC-DC controller 312 and power subsystem 302 provide a regulated voltage via line 316 to power the electronic components in the digital processor unit 304 and peripheral subsystem 306. In the exemplary embodiment shown, the power trench MOSFET device 314 with a depleted gate shield can be implemented, for example, utilizing the power trench MOSFET device 100 with the depleted gate shield depicted in and described with respect to FIGS. 1A-1W and FIG. 2. In one or more embodiments, the components of the electronic system 300 can be implemented in one or more integrated circuits, wafers, chips or dies.

Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that any arrangement, which is calculated to achieve the same purpose, may be substituted for the specific embodiments shown. Therefore, it is manifestly intended that the present application be limited only by the claims and the equivalents thereof. 

What is claimed is:
 1. A method of manufacture of a semiconductor device, comprising: providing a semiconductor substrate doped with a first carrier type; forming a trench in the semiconductor substrate; forming a gate structure in the trench; forming a depleted gate shield structure doped with a second carrier type in the trench and under the gate structure; and depositing an insulating material between the gate structure and the depleted gate shield structure and the sidewalls of the trench.
 2. The method of claim 1, wherein the providing comprises providing the semiconductor substrate doped with an n-type material.
 3. The method of claim 1, wherein the forming the depleted gate shield structure comprises forming the depleted gate shield structure doped with a p-type material.
 4. The method of claim 1, wherein the providing comprises providing the semiconductor substrate doped with a p-type material.
 5. The method of claim 1, wherein the forming the depleted gate shield structure comprises forming the depleted gate shield structure doped with an n-type material.
 6. The method of claim 1, further comprising: electrically connecting the depleted gate shield structure to a source region of the semiconductor device.
 7. The method of claim 1, wherein the forming the gate structure comprises forming a polysilicon layer in the trench.
 8. The method of claim 1, wherein the forming the depleted gate shield structure comprises forming a polysilicon layer under the gate structure and in the trench.
 9. The method of claim 1, wherein the depositing the insulating material comprises filling the trench with a dielectric material.
 10. The method of claim 1, further comprising: controlling a dopant type and doping concentration of the polysilicon depleted gate shield is controlled such that the polysilicon depleted gate shield is substantially depleted when the semiconductor device is turned off.
 11. The method of claim 1, further comprising disposing a dielectric material between the polysilicon gate and the polysilicon depleted gate shield.
 12. The method of claim 11, wherein the dielectric material has a thickness of approximately 20 nanometers (nm).
 13. The method of claim 1, wherein the trench has a width of approximately 0.2 micrometers (μm).
 14. The method of claim 1, further comprising disposing a channel region adjacent to the at least one sidewall.
 15. The method of claim 1, further comprising disposing a drain region in the semiconductor substrate under the trench.
 16. The method of claim 1, wherein the first carrier type is an N conductivity type, and the second carrier type is a P conductivity type.
 17. The method of claim 1, further comprising: disposing a source metal layer disposed on an active side of the semiconductor device; and disposing a drain metal layer on a back side of the semiconductor device. 